Browsing by Subject "thermal interface material"
Now showing items 1-2 of 2
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(2009-05-15)To allow electronic devices to operate within allowable temperatures, heat sinks and fans are employed to cool down computer chips. However, cooling performance is limited by air gaps between the computer chip and the heat ...
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(2011-10-21)Polymer nanocomposites are used in a variety of applications due to their good mechanical properties. Specifically, better performance of lithium ion batteries and thermal interface material can be obtained by using ...